MILPITAS, Calif., Feb. 22, 2017 /PRNewswire/ --KLA-Tencor Corporation(NASDAQ: KLAC) today introduced four innovative metrology systems that enable development and high-volume manufacturing of sub-10nm integrated circuit (IC) devices: the Archer™ 600 overlay metrology system, the WaferSight™ PWG2 patterned wafer geometry measurement system, the SpectraShape™ 10K optical critical dimension (CD) metrology system and the SensArray® HighTemp 4mm in-situ temperature measurement system. These four new systems expand the capability of KLA-Tencor's unique5D Patterning Control Solution™to support advanced patterning techniques, such as self-aligned quadruple patterning (SAQP) and extreme ultraviolet (EUV) lithography.

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"Leading-edge device manufacturers are facing extremely tight patterning specifications," said Oreste Donzella, chief marketing officer at KLA-Tencor. "To understand patterning errors, chipmakers need to quantify process variations, isolate their sources and fix the underlying issues. The new metrology systems announced today generate critical data that engineers can use to specify detailed scanner corrections in the lithography module and process improvements in etch, films and other modules. Our new overlay, patterned wafer geometry, optical critical dimension and in-situ temperature measurement systems serve key roles in driving 193i multi-patterning performance and baselining early EUV lithography results."

弓箭手600扩展成像进行覆盖地铁logy technology with new optics and novel measurement targets, helping chipmakers achieve sub-3nm overlay error for advanced logic and memory devices. Innovative ProAIM™ targets deliver better resilience to process variations and improved correlation between target and device overlay errors, producing more accurate overlay measurements. The Archer 600's new optical technologies, including a higher brightness light source and polarization module, enable tighter overlay error feedback and control across a range of process layers—from thin resists to opaque hard mask materials. With enhanced productivity, the Archer 600 supports increased sampling of overlay error for improved scanner corrections or identification of inline excursions. Multiple Archer 600 systems are already measuring the most advanced devices at foundry, logic and memory manufacturers worldwide.

The WaferSight PWG2 produces comprehensive wafer stress and shape uniformity data, enabling process tool monitoring and matching for film deposition, anneal, etch and other process modules. With significant productivity improvements, the WaferSight PWG2 promotes increased wafer sampling in production, helping chipmakers identify and fix process-induced wafer stress variations that can cause patterning and yield issues. The WaferSight PWG2's wafer shape data can also be fed forward to the lithography scanner to address overlay errors due to wafer stress, a particular concern for 3D NAND devices, which utilize thick film stacks that can distort wafers. With industry-unique vertical wafer hold, the WaferSight PWG2 measures front and back wafer surfaces simultaneously, generating wafer flatness and topography metrics that can improve prediction and control of scanner focus. Several WaferSight PWG2 systems are installed at advanced IC manufacturers, where they are used in development for lithography control, and in high volume manufacturing to optimize and monitor a wide range of fab processes.

Spectrashape 10K基于光学的计量系统测量了蚀刻后复杂的IC设备结构的CD和三维形状，化学机械平面化（CMP）和其他过程步骤。为了全面地表征设备结构，Spectrashape 10K采用了各种光学技术，包括新的极化能力和椭圆计的多发角度，以及带有反射计的Truni™照明的新的高亮度光源。这些技术可以准确测量与FinFET和3D NAND设备相关的众多关键参数，例如CD，高度，SIGE形状和通道孔弓形轮廓。Spectrashape 10K的吞吐量高于其前身，因此有助于更严格的过程控制所需的采样和由于多造影技术而导致的过程层数量的增长。Spectrashape 10K已被Finefet和多模式集成的铸造厂强烈采用，并在所有领先的存储器制造商中支持了高级3D NAND制造的其他系统。

通过原位测量值，Sensarray Hightemp 4mm无线晶片为高级膜过程提供时间和空间温度信息。SensArray Hightemp 4mm具有比其前身更薄的晶状理，与更广泛的工艺工具类型兼容，包括轨道，条带和物理蒸气沉积（PVD）系统。温度范围为20 - 400°C，Sensarray Hightemp 4mm通过绘制可能影响过程窗口和模式性能的热变化来实现过程表征和刀具资格。微处理器，DRAM和3D NAND制造商正在使用多个Sensarray Hightemp 4mm晶片，用于调整和常规的膜应用程序监测。

Archer 600，Wafersight PWG2，Spectrashape 10K和Sensarray Hightemp 4mm与KLA-Tencor集成了5D Analyzer®advanced data analysis system, which supports real-time process control and provides tools for engineering monitoring and analysis. To maintain the high performance and productivity demanded by IC manufacturing, the Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray HighTemp 4mm are backed byKLA-Tencor的全球综合服务网络。有关四个新系统的更多信息，请参见5D Patterning Control Solution web page。

关于KLA-Tencor：
流程控制和收益管理解决方案的领先提供商KLA-Tencor Corporation与世界各地客户合作开发了最新的检查和计量技术。这些技术为半导体，LED和其他相关的纳米电子工业提供服务。该公司拥有由行业标准产品组成的产品组合和世界一流的工程师和科学家团队，为其客户创建了高级解决方案已有40多年的历史了。beplay官网uedKLA-Tencor总部位于加利福尼亚州米尔皮塔斯，在全球范围内专门提供客户运营和服务中心。可以在m.lisalozano.com（KLAC-P）。

Forward Looking Statements:
本新闻稿中的陈述除了历史事实之外，例如有关Archer 600，Wafersight PWG2，Spectrashape 10K和SensArray Hightemp 4mm系统的预期性能的陈述；Archer 600，Wafersight PWG2，Spectrashape 10K和Sensarray Hightemp 4mm系统的扩展性与未来的技术节点；KLA-Tencor的客户的Archer 600，Wafersight PWG2，Spectrashape 10K和Sensarray Hightemp 4mm系统的预期用途；以及Archer 600的用户，Wafersight PWG2，Spectrashape 10K和Sensarray Hightemp 4mm系统可实现的预期成本，运营和其他收益，是前瞻性的陈述，并受到《私人证券诉讼法案法案》的安全港口规定这些前瞻性陈述基于当前的信息和期望，涉及许多风险和不确定性。由于各种因素，包括采用新技术的延迟（无论是由于成本或绩效问题还是其他因素），其他公司引入竞争产品或意外的技术挑战或限制，实际结果可能与此类陈述中预测的结果有重大不同。这会影响KLA-Tencor产品的实施，性能或使用。

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SOURCE KLA-Tencor Corporation