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Substrate Manufacturing
Surfscan®Series
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Unpatterned Wafer Defect Inspection Systems
冲浪者®未饰化的晶圆检测系统识别影响半导体器件性能和可靠性的缺陷和表面质量问题。通过迅速隔离表面缺陷，它通过合格和监测工具，工艺和材料支持IC，OEM，材料和基板制造。
应用程序
Process qualification, Tool qualification, Tool monitoring, Outgoing wafer quality control, Incoming wafer quality control, Resist and scanner qualification, Process debug.
Related Products
Surfscan SP2XP.:
Unpatterned wafer inspection system targeted for technologies ≥ 45nm design node.
下载手册。Surfscan SP2:
Unpatterned wafer inspection system targeted for technologies ≥ 65nm design node.
下载手册。Surfscan SP1DLS.亲：
针对技术≥90nm设计节点的未取消点化晶圆检测系统。
下载手册。Surfscan SP1TBI.亲：
Unpatterned wafer inspection system targeted for technologies ≥ 130nm design node.
下载手册。对此产品感兴趣或有疑问？
Contact UseDR™-5210
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Contact UseDR™-5210
电子束晶圆缺陷审查和分类系统
The eDR™-5210电子束（电子束）晶片缺陷综述和晶片分类系统捕获高分辨率的缺陷图像，在晶片上产生精确表示缺陷群。EDR为KLA检查员提供独特的联系，以便在IC和晶圆制造期间更快地获得。
应用程序
缺陷成像，自动内联缺陷分类和性能管理，裸晶圆出传出和传入质量控制，晶圆处处，热点发现，缺陷发现，过程窗口发现，过程窗口资格，斜面边缘评论。
eDR®is a registered trademark of KLA Corporation.
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Contact Usmicrosense.®C200L＆C200M.
对此产品感兴趣或有疑问？
Contact Usmicrosense.®C200L＆C200M.
200mm硅晶片几何系统
的本®C200L, formerly known as the UltraMap UMA-C200L, and the C200M are industry standard, bare wafer geometry measurement systems used by wafer manufacturers to qualify polished and epitaxial 200mm silicon wafers. Patented dual probe, non-contact capacitance sensors with nanometer resolution offer precise and accurate automated geometry measurements at high throughout. Direct, material-independent, high resolution, high-density measurements (>200,000 data points/200mm wafer) are captured on each wafer to generate 2D and 3D wafer maps. System output metrics include thickness, Total Thickness Variation, bow/warp, wafer P/N type & resistivity as well as flatness measurements for whole wafer, sites, and edge sites. Predefined quality criteria and five cassette hardware configuration allows for flexible wafer sorting options.
Click here to download the MicroSense®C200L＆C200M.brochure.
应用程序
晶圆过程监控和控制，输出晶圆质量控制（OQC）, Incoming quality control wafer fab (IQC).
Related Products
MicroSENSE CSW1：
150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes.
下载手册。microsense.STR1:
150 / 200mm桥接工具用于SI，SIC，GAN，GAAS（在蓝宝石，SIC或SI上），GE和外延流程包括2D应力选项。
下载手册。MicroSENSE BP1：
150/200mm bridge tool for thinned back grind wafers, sawn or polished, for Si, SiC, GaN, GaAs, sapphire.
下载手册。对此产品感兴趣或有疑问？
Contact Usmicrosense.®CSW1.
对此产品感兴趣或有疑问？
Contact Usmicrosense.®CSW1.
150mm/200mm Wafer Geometry System
的本®以前称为UltRAMAP UMA-C200的CSW1是晶圆制造商使用的裸晶片几何测量系统，以资格获得锯，抛光和外延150mm和200mm硅和SIC基板等，包括GaN，GaAs，蓝宝石和外延过程。作为具有两个盒式磁带的桥接工具，CSW1可以同时容纳150和200mm晶片。具有纳米分辨率的专利双探头，非接触式电容传感器在整个方面提供精确和准确的自动几何测量。系统输出包括高密度2D和3D厚度，平坦度，形状，场地平整度和边缘度量的地图。
Click here to download the MicroSense®CSW1.brochure.
应用程序
晶圆过程监控和控制，输出晶圆质量控制（OQC）
Related Products
microsense.C200L/M:
200mm wafer measurement tool for polished silicon and epitaxial wafer manufacturers.
下载手册。microsense.STR1:
150 / 200mm桥接工具用于SI，SIC，GAN，GAAS（在蓝宝石，SIC或SI上），GE和外延流程包括2D应力选项。
下载手册。MicroSENSE BP1：
150/200mm bridge tool for thinned back grind wafers, sawn or polished, for Si, SiC, GaN, GaAs, sapphire.
下载手册。对此产品感兴趣或有疑问？
Contact Usmicrosense.®BP1.
对此产品感兴趣或有疑问？
Contact Usmicrosense.®BP1.
150mm和200mm晶圆几何系统
的本®BP1., formerly known as the UltraMap UMA-200-BP, is a bare wafer geometry measurement system used by wafer manufacturers to qualify sawn, polished and epitaxial silicon and SiC substrates and others including GaN, GaAs, sapphire and epitaxy processes. Wafers and substrates can be round or square and measure up to 200mm in extent. A variety of wafer holders are available. The BP1 precisely measures wafer thickness, flatness and shape using two patented, non-contact, high resolution, auto-positioning back pressure probes. The BP1 is an extremely flexible system that can measure a wide range of wafer thicknesses and any wafer material. Wafer surface finish has no effect on the measurement - the tool measures sawn, lapped or polished wafers.
Click here to download the MicroSense®BP1手册。
应用程序
晶圆过程监控和控制，输出晶圆质量控制（OQC）
Related Products
microsense.C200L/M:
200mm wafer measurement tool for polished silicon and epitaxial wafer manufacturers.
下载手册。microsense.STR1:
150 / 200mm桥接工具用于SI，SIC，GAN，GAAS（在蓝宝石，SIC或SI上），GE和外延流程包括2D应力选项。
下载手册。MicroSENSE CSW1：
150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes.
下载手册。对此产品感兴趣或有疑问？
Contact Us认证和再制造